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Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl 2 /N 2 and Cl 2 /HBr plasmas

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Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. : 168-171

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SiO 2 Etching using high density plasma sources

By Tsukada T.   Nogami H.   Nakagawa Y.   Wani E.   Mashimo K.   Sato H.   Samukawa S.  

Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. : 84-90

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The etching characteristics of SrBi 2 Ta 2 O 9 thin film in CF 4 /Ar plasma using magnetically enhanced inductively coupled plasma

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Thin Solid Films, Vol. 385, Iss. 1, 2001-04 ,pp. : 162-166

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Real dimensional simulation of SiO 2 etching in CF 4 +H 2 plasma

By Knizikevicius R.  

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