Author： Moshfegh A.Z. Akhavan O.
Publisher： Elsevier
ISSN： 0040-6090
Source： Thin Solid Films, Vol.370, Iss.1, 2000-07, pp. : 10-17
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Chemical stability of Ta diffusion barrier between Cu and Si
By Laurila T. Zeng K. Kivilahti J.K. Molarius J. Suni I.
Thin Solid Films, Vol. 373, Iss. 1, 2000-09 ,pp. :
Access to resources
Recommend
Diffusion barrier properties of TaC between Si and Cu
By Imahori J. Oku T. Murakami M.
Thin Solid Films, Vol. 301, Iss. 1, 1997-06 ,pp. :
A comparative study of sputtered TaC x and WC x films as diffusion barriers between Cu and Si
By Wang S.J. Tsai H.Y. Sun S.C.
Thin Solid Films, Vol. 394, Iss. 1, 2001-08 ,pp. :