Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

Author： Volinsky A.A.   Vella J.B.   Gerberich W.W.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.429, Iss.1, 2003-04, pp. : 201-210

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Mechanical properties of W and W(C) thin films: Young's modulus, fracture toughness and adhesion

By Harry E.   Rouzaud A.   Ignat M.   Juliet P.  

Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. : 195-201

Elsevier

Access to resources Recommend Favorite

Mechanical properties and fracture toughness of multilayer hard coatings using nanoindentation

By Ding J.   Meng Y.   Wen S.  

Thin Solid Films, Vol. 371, Iss. 1, 2000-08 ,pp. : 178-182

Elsevier

Access to resources Recommend Favorite

Determination of fracture toughness of bulk materials and thin films by nanoindentation: comparison of different models

By Schiffmann Kirsten Ingolf  

Philosophical Magazine, Vol. 91, Iss. 7-9, 2011-03 ,pp. : 1163-1178

Taylor & Francis Ltd

Access to resources Recommend Favorite

Is the second harmonic method applicable for thin films mechanical properties characterization by nanoindentation?

By Guillonneau G.   Kermouche G.   Teisseire J.   Barthel E.   Bec S.   Loubet J.-L.  

Philosophical Magazine, Vol. 95, Iss. 16-18, 2015-06 ,pp. : 1999-2011

Taylor & Francis Ltd

Access to resources Recommend Favorite

Comparison of mechanical properties of TiN thin films using nanoindentation and bulge test

By Shojaei O.R.   Karimi A.  

Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. : 202-208

Elsevier

Access to resources Recommend Favorite