Titanium nitride diffusion barrier for copper metallization on gallium arsenide

Author: Chen H.C.   Tseng B.H.   Houng M.P.   Wang Y.H.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.445, Iss.1, 2003-11, pp. : 112-117

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Abstract