Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1709-1714

Springer Publishing Company

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Effect of growth rate and lamellar spacing on microhardness in the directionally solidified Pb-Cd, Sn-Zn and Bi-Cd eutectic alloys

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Journal of Materials Science, Vol. 39, Iss. 21, 2004-11 ,pp. : 6571-6576

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Some mechanical properties of Sn–3.5 Ag eutectic alloy at different temperatures

By El-Bahay M. M.   El Mossalamy M. E.   Mahdy M.   Bahgat A. A.  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 8, 2004-08 ,pp. : 519-526

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

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Viscoelastic tensile and shear properties of the 62 wt% Sn–36 wt% Pb–2 wt% Ag solder alloy

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Journal of Materials Science, Vol. 33, Iss. 6, 1998-03 ,pp. : 1607-1610

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