Author: Stockman S. Huang J. Osentowski T. Chui H. Peanasky M. Maranowski S. Grillot P. Moll A. Chen C. Kuo C. Liang B.
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.28, Iss.7, 1999-07, pp. : 916-925
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Abstract
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