Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films

Author： Lau S. Tolentino Ellie Lim Yuen Tolentino Evangeline Koo Ann

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.30, Iss.4, 2001-04, pp. : 299-303

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