Microstructural characterization of inlaid copper interconnect lines

Author: Besser Paul   Zschech Ehrenfried   Blum Werner   Winter Delrose   Ortega Richard   Rose Stewart   Herrick Matt   Gall Martin   Thrasher Stacye   Tiner Mike   Baker Brett   Braeckelmann Greg   Zhao Larry   Simpson Cindy   Capasso Cristiano   Kawasaki Hisao   Weitzman Elizabeth  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.30, Iss.4, 2001-04, pp. : 320-330

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Abstract