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Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2489-2494

Springer Publishing Company

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Local textures and grain boundaries in voided copper interconnects

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Journal of Electronic Materials, Vol. 26, Iss. 9, 1997-09 ,pp. : 996-1001

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Effect of line resistance and driver width on crosstalk in coupled VLSI interconnects

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Large-Scale Synthesis of Graphene Films by Joule-Heating-Induced Chemical Vapor Deposition

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Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

By Dalleau D.   Weide-Zaage K.   Danto Y.  

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