Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

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Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2489-2494

Springer Publishing Company

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Al surface morphology effect on flip-chip solder bump shear strength

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Microelectronics Reliability, Vol. 44, Iss. 2, 2004-02 ,pp. : 323-331

Elsevier

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Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

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A new under bump metallurgy for solder bump flip chip applications

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Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

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