Critical Current Density for Inhibiting (Cu,Ni) 6 Sn 5 Formation on the Ni Side of Cu/Solder/Ni Joints

Author: Wu W.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.39, Iss.12, 2010-12, pp. : 2653-2661

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Abstract