Electrochemical characterization of copper chemical mechanical polishing

By Du T.   Tamboli D.   Desai V.  

Microelectronic Engineering, Vol. 69, Iss. 1, 2003-08 ,pp. : 1-9

Elsevier

Access to resources Recommend Favorite

Slurry components of TiO₂ thin film in chemical mechanical polishing

By Bo Duan   Jianwei Zhou   Yuling Liu   Chenwei Wang   Yufeng Zhang  

Journal of Semiconductors, Vol. 35, Iss. 10, 2014-10 ,pp. : 106003-106007

IOP Publishing

Access to resources Recommend Favorite

Surface roughness of optical quartz substrate by chemical mechanical polishing

By  

Journal of Semiconductors, Vol. 35, Iss. 11, 2014-11 ,pp. : 116001-116005

IOP Publishing

Access to resources Recommend Favorite

Reducing the mechanical action of polishing pressure and abrasive during copper chemical mechanical planarization

By  

Journal of Semiconductors, Vol. 35, Iss. 12, 2014-12 ,pp. : 126001-126005

IOP Publishing

Access to resources Recommend Favorite

A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation

By Fu Guanghui   Chandra Abhijit  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 400-408

Springer Publishing Company

Access to resources Recommend Favorite