Lead-free solder process implementation for PCB assembly

By Collier Peter   Sunappan Vasudivan   Periannan Arulvanan  

Soldering & Surface Mount Technology, Vol. 14, Iss. 3, 2002-12 ,pp. : 12-18

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Process characterization of PCB assembly using 0201 packages with lead-free solder

By Geiger David   Mattsson Fredrik   Shangguan Dongkai   Ong MT   Wong Patrick   Wang Mei   Castello Todd   Yi Sammy  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 22-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints

By Zhong Z.W.   Arulvanan P   Shi X.Q.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 33-37

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The effect of micro via-in pad designs on surface-mount assembly defects: part I ‐ tombstoning

By Lee Yong-Won   Kim Keun-Soo   Suganuma Katsuaki  

Soldering & Surface Mount Technology, Vol. 24, Iss. 3, 2012-06 ,pp. : 197-205

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Complex PCB solutions

By Starkey Pete  

Transactions of the Institute of Metal Finishing, Vol. 89, Iss. 4, 2011-07 ,pp. : 179-180

Maney Publishing

Access to resources Recommend Favorite