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Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 21,issue 3
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Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints
By Lai Yi-Shao,Kao C.R.,Chang Hsiao-Chuan,Kao Chin-Li in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.![](/images/ico/ico5.png)
Edge tail length effect on reliability of DBC substrates under thermal cycling
By Dong Guangcheng,Lei Guangyin (Thomas),Chen Xu,Ngo Khai,Lu Guo-Quan in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.![](/images/ico/ico5.png)
Effect of substrate material and thickness on reliability of ACA bonded flip chip joints
By Frisk Laura,Cumini Anne in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.![](/images/ico/ico5.png)
Composite coating structure in an implantable electronic device
By Kokko Kati,Harjunpää Hanna,Heino Pekka,Kellomäki Minna in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.![](/images/ico/ico5.png)
Reliability analysis of a novel fan-out type WLP
By Yew Ming-Chih,Tsai Mars,Hu Dyi-Chung,Yang Wen-Kun,Chiang Kuo-Ning in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.![](/images/ico/ico5.png)
Six sigma analysis of SMD feeding parameters and board assembly quality
By Kytösaho Pekka,Liukkonen Timo in (2009)
Soldering & Surface Mount Technology,volume 21,issue 3 , Vol. 21, Iss. 3, 2009-06 , pp.