Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

By Lau Chun-Sean   Abdullah M.Z.   Ani F. Che  

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 77-91

Emerald Group Publishing Ltd

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Effects of multiple BGA rework on strength of solder joints

By Dariavach N.   Liang J.   Barr G.   Shangguan D.  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 20-30

Emerald Group Publishing Ltd

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Process and pad design optimization for 01005 passive component surface mount assembly

By Wang Yu   Olorunyomi Michael   Dahlberg Martin   Djurovic Zoran   Anderson Johan   Liu Johan  

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 34-44

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Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls

By Liang J.   Dariavach N.   Callahan P.   Shangguan D.  

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 4-14

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Reflow profile optimization of µ BGA solder joints considering reflow temperature and time coupling

By Bo Tao   Zhouping Yin   Han Ding   Yiping Wu  

Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 38-44

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