Reflow profile optimization of µ BGA solder joints considering reflow temperature and time coupling

Author: Bo Tao   Zhouping Yin   Han Ding   Yiping Wu  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.21, Iss.4, 2009-09, pp. : 38-44

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Abstract