Pb-free solders for flip-chip interconnects

By Frear D.   Jang J.   Lin J.   Zhang C.  

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 28-33

Springer Publishing Company

Access to resources Recommend Favorite

Verification of flip-chip assembly on FR4 boards

By Beelen-Hendrikx Caroline   Verguld Martin  

Soldering & Surface Mount Technology, Vol. 10, Iss. 3, 1998-03 ,pp. : 23-28

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging

By Stoyanov Stoyan   Bailey Chris   Desmulliez Marc  

Soldering & Surface Mount Technology, Vol. 21, Iss. 1, 2009-02 ,pp. : 11-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

By Addagarla Annapurna   Prasad N. Siva  

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The effects of bump height on the reliability of ACF in flip-chip

By Wu C.M.L.   Liu Johan   Yeung N.H.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 1, 2001-01 ,pp. : 25-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite