Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 10,issue 3
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Influences of storage conditions on component cracking
By Feldmann Klaus,Feuerstein Robert,Götz Knuth in (1998)
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.Finite element modelling of printed circuit boards (PCBs) for structural analysis
By Lee Miky,Centre Production Engineering Research,Inc LG Electronics, Pyungtaik, Korea in (1998)
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.Gallium-based interconnects for flip-chip assembly
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.Verification of flip-chip assembly on FR4 boards
By Beelen-Hendrikx Caroline,Verguld Martin in (1998)
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion
By Jang Se-Young,Paik Kyung-Wook in (1998)
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.The role of intermetallic compounds in lead-free soldering
By Harris Paul G,Chaggar Kaldev S in (1998)
Soldering & Surface Mount Technology,volume 10,issue 3 , Vol. 10, Iss. 3, 1998-03 , pp.