Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

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Acta Materialia, Vol. 52, Iss. 1, 2004-01 ,pp. : 129-136

Elsevier

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Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples

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Study of under bump metallisation barrier layer for lead-free solder

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