Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples

Author: Xu Guangchen   Guo Fu   Xia Zhidong   Lei Yongping   Shi Yaowu   Li Xiaoyan  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.19, Iss.5, 2010-07, pp. : 616-622

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Abstract