Author: Xu Guangchen Guo Fu Xia Zhidong Lei Yongping Shi Yaowu Li Xiaoyan
Publisher: Springer Publishing Company
ISSN: 1059-9495
Source: Journal of Materials Engineering and Performance, Vol.19, Iss.5, 2010-07, pp. : 616-622
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure
By Nah J.-W. Kim J.H. Lee H.M. Paik K.-W.
Acta Materialia, Vol. 52, Iss. 1, 2004-01 ,pp. :
By Liang J. Dariavach N. Callahan P. Shangguan D.
Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. :