Author： Vanhoestenberghe Anne
Publisher： Emerald Group Publishing Ltd
ISSN： 0260-2288
Source： Sensor Review, Vol.29, Iss.4, 2009-09, pp. : 345-348
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Abstract
Purpose ‐ The purpose of this paper is to discuss the requirements for long-term implantation of electronic devices with a focus on packaging and encapsulation. Design/methodology/approach ‐ Owing to their intended long-term use in the human body, implants for electrical stimulation present specific challenges to the engineers. The respective roles of packaging and encapsulation must be clearly understood to make the most of new materials and modern machining technologies. This paper offers an introduction to the current situation and highlights challenges for future developments. Findings ‐ The innovative application of modern technologies may be useful to tackle key issues of encapsulation and sealing of small electrical devices for long-term implantation. Originality/value ‐ Two examples of innovative application of alternative package manufacture and sealing method are described.
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