Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Author： Lee Shi-Wei Ricky   Lui Ben Hoi Wai   Kong Y.H.   Baylon Bernard   Leung Timothy   Umali Pompeo   Agtarap Hector  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.14, Iss.3, 2002-12, pp. : 46-50

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