The effect of the hot air levelling process on skip solder defects in the wave soldering process
Author： Choon Teo Kiat
Publisher： Emerald Group Publishing Ltd
ISSN： 0954-0911
Source： Soldering & Surface Mount Technology, Vol.15, Iss.2, 2003-06, pp. : 28-34
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
