Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 15,issue 3
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Improving the fatigue life of a bare die flip chip by thinning
By Alander T.,Suominen I.,Heino P.,Ristolainen E. in (2003)
Soldering & Surface Mount Technology,volume 15,issue 3 , Vol. 15, Iss. 3, 2003-12 , pp.Flip chip solder joint reliability under harsh environment
By Bo Cheng,Li Wang,Qun Zhang,Xia Gao,Xiaoming Xie,Kempe Wolfgang in (2003)
Soldering & Surface Mount Technology,volume 15,issue 3 , Vol. 15, Iss. 3, 2003-12 , pp.Mechanical characterization of Sn-3.5Ag solder joints at various temperatures
By Rhee H.,Subramanian K.N.,Lee A.,Lee J.G. in (2003)
Soldering & Surface Mount Technology,volume 15,issue 3 , Vol. 15, Iss. 3, 2003-12 , pp.Failures of flip chip assemblies under thermal shock
By Bo Cheng,Li Wang,Qun Zhang,Xia Gao,Xiaoming Xie,Kempe Wolfgang in (2003)
Soldering & Surface Mount Technology,volume 15,issue 3 , Vol. 15, Iss. 3, 2003-12 , pp.Thermal strain analysis of an electronics package using the SEM Moiré technique
By Zhong Z.W.,Nah S.K. in (2003)
Soldering & Surface Mount Technology,volume 15,issue 3 , Vol. 15, Iss. 3, 2003-12 , pp.