Thermal strain analysis of an electronics package using the SEM Moiré technique

Author: Zhong Z.W.   Nah S.K.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.15, Iss.3, 2003-12, pp. : 33-35

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract