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Soldering & Surface Mount Technology, Vol. 14, Iss. 3, 2002-12 ,pp. : 46-50

Emerald Group Publishing Ltd

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Ceramic chip scale package solder joint reliability

By Seyyedi J.   Padgett J.  

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Design of Experiments Study of Hydroxyapatite Synthesis for Orthopaedic Application Using Fractional Factorial Design

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Journal of Materials Engineering and Performance, Vol. 20, Iss. 8, 2011-11 ,pp. : 1423-1437

Springer Publishing Company

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Improving the reliability of a plastic IC package in the reflow soldering process by DOE

By Kim Geun Woo   Lee Kang Yong  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 40-48

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Solder joint formation simulation and reliability study of quad flat no lead package

By Huang C. Y.   Wu Z. H.   Zhou D. J.  

Science and Technology of Welding & Joining, Vol. 12, Iss. 1, 2007-01 ,pp. : 100-105

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