

Author: Nousiaianen Olli Rautioaho Risto Kautio Kari Jääskeläinen Jussi Leppävuori Seppo
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.17, Iss.3, 2005-09, pp. : 32-42
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content




Ceramic chip scale package solder joint reliability
Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. :



