The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Author: Huang Meng-Kuang   Lee Chiapyng   Wu Pei-Lin   Tzan Shyh-Rong  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.17, Iss.3, 2005-09, pp. : 3-8

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