Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints

By Sun Peng   Andersson Cristina   Wei Xicheng   Cao Liqiang   Cheng Zhaonian   Liu Johan  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 38-45

Emerald Group Publishing Ltd

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Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

By Seo Sun-Kyoung   Kang Sung   Cho Moon   Lee Hyuck  

JOM, Vol. 62, Iss. 7, 2010-07 ,pp. : 22-29

Springer Publishing Company

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A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints

By Liu De-Shin   Hsu Chang-Lin   Kuo Chia-Yuan   Huang Ya-Ling   Lin Kwang-Lung   Shen Geng-Shin  

Soldering & Surface Mount Technology, Vol. 24, Iss. 1, 2012-02 ,pp. : 22-29

Emerald Group Publishing Ltd

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Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John   Hoo Nick   Horsley Rob   Smetana Joe   Shangguan Dongkai   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 46-68

Emerald Group Publishing Ltd

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Pb-free solder bumping for flip chip package by electroplating

By Hwang Hyeon   Hong Soon-Min   Jung Jae-Pil   Kang Choon-Sik  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 10-16

Emerald Group Publishing Ltd

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