Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

Author: Ye L.   Lai Z.H.   Liu J.   Thölén A.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.13, Iss.3, 2001-12, pp. : 16-20

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