Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 30-39

Emerald Group Publishing Ltd

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Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy

By Chuang Tung-Han   Jain Chao-Chi  

Metallurgical and Materials Transactions A, Vol. 42, Iss. 3, 2011-03 ,pp. : 684-691

Springer Publishing Company

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Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint

By Chen S.   Sun P.   Wei X.C.   Cheng Z.N.   Liu J.  

Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 48-54

Emerald Group Publishing Ltd

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Effect of crystallographic anisotropy of β-tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects

By Terashima S.   Kobayashi T.   Tanaka M.  

Science and Technology of Welding & Joining, Vol. 13, Iss. 8, 2008-11 ,pp. : 732-738

Maney Publishing

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Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

By Zeng Guang   Xue Songbai   Zhang Liang   Sheng Zhong   Gao Lili  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 57-64

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