Effects of bulk Cu 6 Sn 5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints

Author: Zhang Liang   Xue Song-bai   Gao Li-li   Sheng Zhong   Dai Wei   Ji Feng   Ye Huan   Chen Yan   Yu Sheng-lin  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.23, Iss.1, 2011-02, pp. : 4-9

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