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Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 4-9

Emerald Group Publishing Ltd

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Interfacial microstructure, shear strength and electrical conductivity of Sn–3˙5Ag–0˙5In/Cu lead free soldered joints

By Kar A.   Ghosh M.   Majumdar B. S.   Ghosh R. N.   Ray A. K.  

Materials Technology: Advanced Performance Materials, Vol. 22, Iss. 3, 2007-09 ,pp. : 161-165

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

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Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 32-37

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Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

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Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate

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