A Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip-chip Bonding*

Author： Itagaki M   Bessho Y   Eda K   Ishida T  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.14, Iss.3, 1997-03, pp. : 15-18

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