Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications

Author： Lopez C. Chai L. Shaikh A. Stygar V.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.44, Iss.2, 2004-02, pp. : 287-294

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

A Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip-chip Bonding*

By Itagaki M Bessho Y Eda K Ishida T

Microelectronics International, Vol. 14, Iss. 3, 1997-03 ,pp. : 15-18

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Studies on laser ablation of low temperature co-fired ceramics (LTCC)

By Yung Winco K.C. Zhu Jijun

Microelectronics International, Vol. 24, Iss. 3, 2007-07 ,pp. : 27-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Three axial low temperature cofired ceramic accelerometer

By Jurków Dominik

Microelectronics International, Vol. 30, Iss. 3, 2013-07 ,pp. : 125-133

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Influence of co-firing process condition on low temperature co-fired ceramics membrane deflection

By Jurków Dominik

Microelectronics International, Vol. 31, Iss. 3, 2014-07 ,pp. : 193-200

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Ion-selective electrode made with LTCC (low temperature co-fired ceramics) technology

By Malecha Karol Dawgul Marek Pijanowska Dorota

Microelectronics International, Vol. 31, Iss. 3, 2014-07 ,pp. : 201-206

Emerald Group Publishing Ltd

Access to resources Recommend Favorite