The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

By Shnawah Dhafer Abdul Ameer   Said Suhana Binti Mohd   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Che Fa Xing  

Soldering & Surface Mount Technology, Vol. 24, Iss. 4, 2012-09 ,pp. : 257-266

Emerald Group Publishing Ltd

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Research Summary: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties

By Anderson I.E.   Cook B.A.   Harringa J.L.   Terpstra R.L.  

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 26-29

Springer Publishing Company

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The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process

By Gao Li-li   Xue Song-bai   Zhu Hong  

Soldering & Surface Mount Technology, Vol. 24, Iss. 3, 2012-06 ,pp. : 216-222

Emerald Group Publishing Ltd

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