High-yield dicing of anodically bonded silicon–glass wafers by pressure-induced fracture

Author： Robaina R R Lopez-Martinez M J Perez-Castillejos R Plaza J A

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.22, Iss.2, 2012-02, pp. : 25023-25029

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