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Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

Springer Publishing Company

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Thermomigration and electromigration in Sn58Bi ball grid array solder joints

By Gu X.   Yung K.   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 10, 2010-10 ,pp. : 1090-1098

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Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

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Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 11, 2006-11 ,pp. : 943-950

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Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

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