Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

Springer Publishing Company

Access to resources Recommend Favorite

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

By Wu B.   Zhong H.   Chan Y.   Alam M.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 11, 2006-11 ,pp. : 943-950

Springer Publishing Company

Access to resources Recommend Favorite

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

By Zhong W.   Chan Y.   Wu B.   Alam M.   Guan J.  

Journal of Materials Science, Vol. 42, Iss. 13, 2007-07 ,pp. : 5239-5247

Springer Publishing Company

Access to resources Recommend Favorite

Thermomigration and electromigration in Sn58Bi ball grid array solder joints

By Gu X.   Yung K.   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 10, 2010-10 ,pp. : 1090-1098

Springer Publishing Company

Access to resources Recommend Favorite

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

Springer Publishing Company

Access to resources Recommend Favorite