Thermomigration and electromigration in Sn58Bi ball grid array solder joints

Author: Gu X.   Yung K.   Chan Y.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.10, 2010-10, pp. : 1090-1098

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Abstract