Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Author: Chae Seung-Hyun   Zhang Xuefeng   Lu Kuan-Hsun   Chao Huang-Lin   Ho Paul   Ding Min   Su Peng   Uehling Trent   Ramanathan Lakshmi  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.1-3, 2007-03, pp. : 247-258

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Abstract