Effects of electromigration on resistance changes in eutectic SnBi solder joints

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Journal of Materials Science, Vol. 46, Iss. 10, 2011-05 ,pp. : 3544-3549

Springer Publishing Company

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Electromigration issues in lead-free solder joints

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Thermomigration and electromigration in Sn58Bi ball grid array solder joints

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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

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Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

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