The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

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Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

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Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

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Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

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Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 12, 2013-12 ,pp. : 4881-4887

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Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

By Gao Lili   Xue Songbai   Zhang Liang   Xiao Zhengxiang   Dai Wei   Ji Feng   Ye Huan   Zeng Guang  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 9, 2010-09 ,pp. : 910-916

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

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