Author: Su T. Tsao L. Chang S. Chuang T.
Publisher: Springer Publishing Company
ISSN: 1059-9495
Source: Journal of Materials Engineering and Performance, Vol.11, Iss.5, 2002-10, pp. : 481-486
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum
JOM, Vol. 56, Iss. 6, 2004-06 ,pp. :
By Guo F Choi S Lucas J.P. Subramanian K.N.
Soldering & Surface Mount Technology, Vol. 13, Iss. 1, 2001-01 ,pp. :