Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

Author： Guo F Choi S Lucas J.P. Subramanian K.N.

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.13, Iss.1, 2001-01, pp. : 7-18

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