A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints

Author： Suh J.   Tu K.   Tamura N.  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.58, Iss.6, 2006-06, pp. : 63-66

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