Solvent-free thermoplastic-poly(dimethylsiloxane) bonding mediated by UV irradiation followed by gas-phase chemical deposition of an adhesion linker

Author： Ahn S Y   Lee N Y  

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|7|75007-75014

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.7, 2015-07, pp. : 75007-75014

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