Highly Conductive Cu Thin Film Deposition on Polyimide by RF‐Driven Atmospheric Pressure Plasma Jets under Nitrogen Atmosphere

Publisher: John Wiley & Sons Inc

E-ISSN: 1612-8869|12|5|431-438

ISSN: 1612-8850

Source: PLASMA PROCESSES AND POLYMERS (ELECTRONIC), Vol.12, Iss.5, 2015-05, pp. : 431-438

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