Related content

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

By Straessle R   Pétremand Y   Briand D   Dadras M   de Rooij N F  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75007-75014

IOP Publishing

Access to resources Recommend Favorite

A novel prototyping method for die-level monolithic integration of MEMS above-IC

By Cicek Paul-Vahe   Zhang Qing   Saha Tanmoy   Mahdavi Sareh   Allidina Karim   Nabki Frederic   Mourad El Gamal  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 6, 2013-06 ,pp. : 65013-65021

IOP Publishing

Access to resources Recommend Favorite

Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

By Gong Zhuhao   Zhang Yulong   Guo Xin   Liu Zewen  

Micromachines, Vol. 9, Iss. 3, 2018-02 ,pp. : 93-93

MDPI

Access to resources Recommend Favorite

A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

By  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 12, 2015-12 ,pp. : 125030-125040

IOP Publishing

Access to resources Recommend Favorite

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

By Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 192-192

MDPI

Access to resources Recommend Favorite