A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|12|125030-125040

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.12, 2015-12, pp. : 125030-125040

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